There is an Aron Alhpa adhesive suitable for instantaneous and permanent bonds to almost all materials, Aron Alpha adhesives are composed of alpha cyano-acrylate monomers (liquid state). When this adhesive is spread thinly on the surfaces to be bonded, the small quantity of moisture on the surface acts as a hardening agent, rapidly turning the monomer into a solid polymer and bonding the materials



Hardloc Adhesive is a two component Acrylic Adhesive. It is a new modified series of acrylic type high – performance adhesive originally developed by DENKA'S unique technology. Excellent in impact resistance, curable at an ambient temperature, and of a two – component, non – mixing type, the adhesive can contribute to remarkable improving working efficiency. The adhesives are most suitable for bonding metals, ceramics, plastics, lens and other materials.

Hardloc adhesive is manufactured by Denki Kagaku Kogyo Kabushiki Kaisha.


Hardloc Characteristics

Classification Characteristics
Modified acrylic
  1. Quickly cures at room temperature, therefore simplifying procedures,
  2. Superb resistance to shearing, impact and peeling.
Ultraviolet / Heat curing
  1. Quickly cures with either exposure to ultraviolet light or when used together with the heat curing process,
  2. May be applied with either pin transferring, screen printing or with the dispenser.
Two-liquid type urethane
  1. Quickly cures in room temperature and no solvents are used. Excellent initial bond strength and workability.
  2. The adhesive layer possesses excellent flexibility, and superb resistance to shearing, impact and peeling.


Diabond adhesives have been developed in various types according to rapid progress of Japanese industries, and are widely used in many industrial fields such as Automobiles, Electric and Electronics, Ship Buildings , Construction, Shoes Making, Furniture and general Home-use.

Diabond has various adhesive for bonding different materials, including metals to vulcanized rubbers and many kinds of plastic.

It also has unique series of adhesive for speaker assembly purpose.

One-Component Epoxy Resin of Epi Fine


Epi Fine series consist of one-component epoxy resin, which is, designed for high reliability relay parts applications. This product also finds utility in such micro electronic applications as sensors, switches, and ceramic filters.
In the market place there are several weakness of one-component epoxy resin for relay parts. Some of the issues associated with these types are as follows.

- It needs to be stored under refrigerated conditions.
- There is much out gassing and shrinkage while thermal curing.
- Poor adhesive force. Easy to remove from plastics such as PC, PBT, and LCP.
- Difficult to control flow length.
- Uncured in small gaps due to separation of resin and hardener by capillary action.
- Low C.T.I. (Comparative Tracking Index) value.

Kisco has developed a new product Epi Fine series, which overcomes the above problems. Epi Fine series was especially formulated for the micro relay.

Active post 30 days at 40 degree C Long lifetime
No organic gas generated during reaction Contamination is eliminated
Excellent surface adhesion between plastics
and epoxy resin
Complete seal
Good heat and chemical resistance Device protection
Controlled epoxy flow characters Device protection
Over 560V for C.T.I value (IEC 112) Excellent reliability


Epi Fine series is set to gel within 5.5 minutes at 100 degree C. Total time for hardening to occur is 30 minutes at 120 degree C.

Epi Fine series have some items which could cured at 80 oC, it is especially suitable for low dimensional stability resin parts.