Kisco

TOAGOSEI-ARON ALPHA

瞬间强力粘合剂

ARON ALPHA(AA 超能胶)能够在大多数的材料粘合面上提供瞬间及永久性的粘合力量，而此胶的基层份子为“Cyano-acrylate 氢基丙烯酸脂”单体(MONOMER)液体。在粘合的表面上涂上一层很薄的 AA 超能胶，其单体份子会立刻吸收附近空气中的水分(媒介体)而形成此粘合层的强实聚合物(Polymer)。

 
 
 
 
Hardloc

Hardloc是二液型的胶水，它是新改良丙烯酸系列的高效能胶水，由DENKA的独特技术发展而成，有很好的耐撞能力，可在室温的情况下固化，不需混合的二液型胶水有显著的改善工作效率的功能。这胶水适合接着金属、陶瓷、塑料、镜片和其它物料。

生产商- Denki Kagaku Kogyo Kabushiki Kaisha.

 

Hardloc 的特征
类别 特征
改良丙烯酸
  1. 简单的步骤和在室温下很快固化。
  2. 极好的耐碰撞、防松脱和耐磨擦等功能。
紫外线 / 热固化
  1. 当用紫外线照射和加热，会加快固化的速度。
  2. 对长方形、圆形和不规则的琐碎物有极好的接着力。
二液型
  1. 在室温下，胶水的固化速度很快和不需使用溶剂。极好的接着力。
  2. 胶水层有极好的弹性和极好的耐碰撞、防松脱和耐磨擦等功能。
 
 
 
 
Diabond

在日本工业快速增长下，Diabond己经发展出很多不同种类的胶水。而这些胶水则应用于不同的工业范畴，例如 : 汽车、电子和电机工业、造船、建筑、造鞋、家俱和家庭用品。

Diabond 有很多种类的胶水，用于接着不同种类的物质，包括金属和硬化的橡，还有不同种类的塑料。

Diabond 有一系列的胶水主要是用在组装扬声器的。

 
 
 
 
One-Component Epoxy Resin of Epi Fine

DESCRIPTION

Epi Fine series consist of one-component epoxy resin, which is, designed for high reliability relay parts applications. This product also finds utility in such micro electronic applications as sensors, switches, and ceramic filters.
In the market place there are several weakness of one-component epoxy resin for relay parts. Some of the issues associated with these types are as follows.

- It needs to be stored under refrigerated conditions.
- There is much out gassing and shrinkage while thermal curing.
- Poor adhesive force. Easy to remove from plastics such as PC, PBT, and LCP.
- Difficult to control flow length.
- Uncured in small gaps due to separation of resin and hardener by capillary action.
- Low C.T.I. (Comparative Tracking Index) value.

Kisco has developed a new product Epi Fine series, which overcomes the above problems. Epi Fine series was especially formulated for the micro relay.

FEATURES BENEFITS
Active post 30 days at 40 degree C Long lifetime
No organic gas generated during reaction Contamination is eliminated
Excellent surface adhesion between plastics
and epoxy resin
 Complete seal
Good heat and chemical resistance Device protection
Controlled epoxy flow characters Device protection
Over 560V for C.T.I value (IEC 112) Excellent reliability


LOW CURING TEMPERATURE PROCESS CONDITIONS

Epi Fine series is set to gel within 5.5 minutes at 100 degree C. Total time for hardening to occur is 30 minutes at 120 degree C.

Epi Fine series have some items which could cured at 80 oC, it is especially suitable for low dimensional stability resin parts.